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J-STD-005 - Complete Document

Revision / Edition: 95 Chg: A1 Date: 06/01/96

REQUIREMENTS FOR SOLDERING PASTES

Comments:	SEE ALSO J-STD-005 CD
Superseding Document:
Page Count:	49
In Stock:	Yes
Hardcopy Price:	$ 52.00
Secure PDF Price :	$ 57.00

Document Abstract

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

View Referenced Standards

Customers who purchased J-STD-005 have also purchased
	J-STD-006 : REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
	J-STD-004 : REQUIREMENTS FOR SOLDERING FLUXES
	J-STD-001 : REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
	IPC-A-610 : ACCEPTABILITY OF ELECTRONIC ASSEMBLIES (ALSO SEE IPC-A-610 CD, IPC-A-610 ILL-S, J-STD-001, J-STD-002, IPC-7711, AND IPC-7721)
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