Popular Standards |
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EIAJ CP 1201 | DIGITAL AUDIO INTERFACE |
EIAJ CP 2402 | METHODS OF MEASURING THE CHARACTERISTICS OF REPRODUCING EQUIPMENT FOR DIGITAL AUDIO COMPACT DISCS |
EIAJ CP 2903 | CLASSIFICATION AND MEASURING METHOD FOR LOW MAGNETIC LEAKAGE FLUX LOUDSPEAKER SYSTEMS |
EIAJ CP 4108 | METHODS OF MEASUREMENT FOR HDTV DISPLAY |
EIAJ CPR 1204 | TRANSFER METHOD OF VIDEO ID INFORMATION USING VERTICAL BLANKING INTERVAL (525 LINE SYSTEM) |
EIAJ CPR 1204-1 | TRANSFER METHOD OF VIDEO ID INFORMATION USING VERTICAL BLANKING INTERVAL: SUPPLEMENT TO EIAJ CPR 1204 |
EIAJ ED 4701 | ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SEMICONDUCTOR DEVICES |
EIAJ ED 7300 | RECOMMENDED PRACTICE ON STANDARD FOR THE PREPARATION OF OUTLINE DRAWINGS OF SEMICONDUCTOR PACKAGES |
EIAJ ED 7401 | RECOMMENDED PRACTICE FOR THE PREPARATION OF OUTLINE DRAWINGS OF SEMICONDUCTOR DEVICES (INTEGRATED CIRCUITS |
EIAJ ED 7401A | RECOMMENDED PRACTICE ON GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SEMICONDUCTOR PACKAGES (INTEGRATE |
EIAJ ED 7402-1 | GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS SMALL OUTLINE PACKAGES |
EIAJ ED 7402-3 | GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS THIN SMALL OUTLINE PACKAGES (TYPE I |
EIAJ ED 7404A | GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS QUAD FLAT PACKAGES (QFP) |
EIAJ ED 7406 | GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS SMALL OUTLINE J-LEAD PACKAGES |
EIAJ ED 7406A | GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS SMALL OUTLINE J-LEAD PACKAGES (SOJ) |
EIAJ ED 7501 | RECOMMENDED PRACTICE FOR THE PREPARATION OF OUTLINE DRAWINGS OF SEMICONDUCTOR DEVICES (DISCRETE SEMICONDUCTOR DEVICE |
EIAJ ED 8403 | ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SEMICONDUCTOR PRESSURE SENSORS (DIFFUSED PIEZORESISTANCE TYPE) |
EIAJ EDR 7311 | DESIGN GUIDELINE OF INTERGRATED CIRCUITS FOR QUAD FLAT PACKAGE |
EIAJ EDR 7312 | DESIGN GUIDELINE OF INTEGRATED CIRCUITS FOR THIN SMALL OUTLINE PACKAGE (TYPE I) |
EIAJ INDEX | STANDARDS OF ELECTRONIC INDUSTRIES ASSOCIATION OF JAPAN |
EIAJ INDEX (E) | PUBLICATIONS CATALOGUE OF ELECTRONIC INDUSTRIES ASSOCIATION OF JAPAN |
EIAJ RC 5320A | PLUGS AND JACKS FOR COUPLINGS AN EXTERNAL LOW VOLTAGE POWER SUPPLY |
EIAJ RC 8124 | LOUDSPEAKER SYSTEMS |
