This standard describes a baseline set of acceptance tests for use in qualifying electronic devices as new products, a product family, or as products in a process which is being changed.

These tests are capable of stimulating and precipitating semiconductor device and packaging failure modes on free-standing devices not soldered to a printed wired board (PWB), or the like (base device reliability). The objective is to precipitate failures in an accelerated manner compared to use conditions. Failure Rate projections usually require larger sample sizes than are called out in qualification testing. For guidance on projecting failure rates, refer to JESD85 Methods for Calculating Failure Rates in Units of FITs.