12887

ASTM F638-88(2001) [ Withdrawn ]

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

standard by ASTM International , 01/01/2001

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Full Description

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

 

Product Details

Published:
01/01/2001
Number of Pages:
3
File Size:
1 file , 38 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. ASTM F638-88(2001)

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    Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

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  2. ASTM F638-88(1995)e1


    Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

    • Historical Version