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About This Item

 

Full Description

MIL-STD-1276J establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith, and the sizes of wire and flat wire (ribbon) leads on electronic and electrical parts when they are to be soldered or welded during assembly in equipment.
 

Document History

  1. MIL MIL-STD-1276J

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    Leads for Electronic Component Parts

    • Most Recent
  2. MIL MIL-STD-1276H


    Leads for Electronic Component Parts

    • Historical Version
  3. MIL MIL-STD-1276G


    LEADS FOR ELECTRONIC COMPONENT PARTS (SUPERSEDING MIL-STD-1276F)

    • Historical Version
  4. MIL MIL-STD-1276F


    LEADS FOR ELECTRONIC COMPONENT PARTS (SUPERSEDING MIL-STD-1276E) (S/S BY MIL-STD-1276G)

    • Historical Version
  5. MIL MIL-STD-1276E


    LEADS FOR ELECTRONIC COMPONENT PARTS (SUPERSEDING MIL-STD-1276D) (S/S BY MIL-STD-1276F)

    • Historical Version
  6. MIL MIL-STD-1276D


    LEADS FOR ELECTRONIC COMPONENT PARTS (S/S BY MIL-STD-1276E)

    • Historical Version