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About This Item

 

Full Description

This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

 

Document History

  1. SAE AMS3684C

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    Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled (Stabilized: Oct 2016)

    • Most Recent
  2. SAE AMS3684B


    RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled (Noncurrent: Jan 1993)

    • Historical Version