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Full Description

1.1 This practice is intended to serve as a guide for the proper preparation of copper and its alloys for electroplating and conversion coating. This practice is also suitable for use before autocatalytic plating. Only alloys containing at least 50 mass % copper are considered within the scope of this practice.

1.2 The wide variety of methods of mechanical finishing are not considered strictly as preparation for electroplating or conversion coating and consequently are described only briefly.

1.3 Details of electroplating and subsequent treatments for applying conversion coatings are not within the scope of this practice.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. For a specific hazard statement, see 6.5.2.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

 

Document History

  1. ASTM B281-88(2019)e1

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    Standard Practice for Preparation of Copper and Copper-Base Alloys for Electroplating and Conversion Coatings

    • Most Recent
  2. ASTM B281-88(2013)


    Standard Practice for Preparation of Copper and Copper-Base Alloys for Electroplating and Conversion Coatings

    • Historical Version
  3. ASTM B281-88(2008)


    Standard Practice for Preparation of Copper and Copper-Base Alloys for Electroplating and Conversion Coatings

    • Historical Version
  4. ASTM B281-88(1995)


    Standard Practice for Preparation of Copper and Copper-Base Alloys for Electroplating and Conversion Coatings

    • Historical Version
  5. ASTM B281-88(2001)


    Standard Practice for Preparation of Copper and Copper-Base Alloys for Electroplating and Conversion Coatings

    • Historical Version