1759066

IPC 9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

standard by Association Connecting Electronics Industries , 12/01/2010

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Full Description

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.
 

Product Details

Published:
12/01/2010
Number of Pages:
24
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus