ASTM F1211-89(2001) [ Withdrawn ]

Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

standard by ASTM International , 01/01/2001

View all product details

Most Recent

Track It

- Available Formats
  ℹ
- Options
- Availability
- Priced From ( in USD )
- PDF
- 👥
- Immediate download
- $50.00
- Add to Cart
- Printed Edition
- Ships in 1-2 business days
- $50.00
- Add to Cart
- Printed Edition + PDF
- Immediate download
- $68.00
- Add to Cart

Customers Who Bought This Also Bought

ASTM F1662-16
Priced From $66.00
ASTM F1684-06(2021)
Priced From $52.00
ASTM F1390-02
Priced From $58.00
ASTM F576-01
Priced From $58.00

Full Description

1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.

1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

Product Details

Published:: 01/01/2001
Number of Pages:: 3
File Size:: 1 file , 29 KB
Note:: This product is unavailable in Russia, Ukraine, Belarus