1762638

JEDEC JESD61A.01

ISOTHERMAL ELECTROMIGRATION TEST PROCEDURE

standard by JEDEC Solid State Technology Association , 10/01/2007

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Full Description

This standard describes an algorithm for the execution of the isothermal test, using computer-controlled instrumentation. The primary use of this test is for the monitoring of microelectronic metallization lines at wafer level (1) in process development, to evaluate process options, (2) in manufacturing, to monitor metallization reliability and (3) to monitor/evaluate process equipment. While it is developed as a fast WLR test, it can also be an effective tool for complementing the reliability data obtained through the standard package level electromigration test.
 

Product Details

Published:
10/01/2007
Number of Pages:
49
File Size:
1 file , 480 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus