2076671 Preview

JEDEC JESD51-4A

Thermal Test Chip Guideline (Wire Bond Type Chip)

standard by JEDEC Solid State Technology Association , 06/01/2019

View all product details

Most Recent

Track It

Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $67.00
    • Add to Cart
    • Printed Edition + PDF
    • Immediate download
    • $90.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

The purpose of this document is to provide a design guideline for thermal test chips used for integrated circuit (IC) and transistor package thermal characterization and investigations. The intent of this guideline is to minimize the differences in data gathered due to nonstandard test chips and to provide a well-defined reference for thermal investigations.
 

Product Details

Published:
06/01/2019
Number of Pages:
26
File Size:
1 file , 1.2 MB
Redline File Size:
2 files , 5.8 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD51-4A

    👀 currently
    viewing


    Thermal Test Chip Guideline (Wire Bond Type Chip)

    • Most Recent

  2. JEDEC JESD51-4


    THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)

    • Historical Version