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IPC 7092A

Design and Assembly Process Implementation for Embedded Components

standard by Association Connecting Electronics Industries , 10/01/2022

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Full Description

This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.

 

Product Details

Published:
10/01/2022
ISBN(s):
9781638160946
Number of Pages:
124
File Size:
1 file , 8.2 MB
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This product is unavailable in Russia, Ukraine, Belarus
 

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    Design and Assembly Process Implementation for Embedded Components

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