17306

IPC SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

standard by Association Connecting Electronics Industries , 01/01/1989

View all product details

Most Recent

Track It

Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Secure PDF 🔒
    • Immediate download
    • $88.00
    • Add to Cart
    • Printed Edition
    • Ships in 3-5 business days
    • $83.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.
 

Product Details

Published:
01/01/1989
Number of Pages:
54
File Size:
1 file , 1.4 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus