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About This Item

 

Full Description

The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

 

Document History

  1. JEDEC J-STD-020F

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    JOINT IPC/JEDEC STANDARD FOR Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

    • Most Recent
  2. JEDEC J-STD-020E


    JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES

    • Historical Version
  3. JEDEC J-STD-020D.01


    JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES

    • Historical Version