Standards Store
Store Home   |    My Account   |    Help & Support   |    About IHS Markit   |    Contact IHS Markit   |    Sign In   
Standards Store Homepage TIA Standards Homepage Order online or call our sales team: 1-877-413-5184
 

TIA TSB-144

2003 Edition, April 2003

Complete Document

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

Includes all amendments and changes through Reaffirmation Notice , January 2012


Detail Summary

Active, Most Current

EN
Format
Details
Price (USD)
Secure PDF
Single User
$88.00
Print
In Stock
$88.00
PDF + Print
In Stock
$140.80 You save 20%
Add to Cart

People Also Bought These:

EIA-541
TIA-455-187

Product Details:


Description / Abstract:

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.