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9984825

6th Edition, December 2017

Complete Document

Primer – High Bake, Conductive Sealing for SMC Substrates



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Active, Most Current

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Product Details:

  • Revision: 6th Edition, December 2017
  • Published Date: December 2017
  • Status: Active, Most Current
  • Document Language: English
  • Published By: General Motors Company (GMNA)
  • Page Count: 4
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This specification covers the requirements for a high bake conductive, sealing, primer for use over Sheet Molding Compound (SMC) and rigid plastics with a paint bake latitude of approximately 115 °C to 135 °C (240 °F to 275 °F). The primer shall provide a smooth, adhesion promoting, conductive surface for electrostatic application of subsequent coatings. The primer must be sandable, have the ability to fill minor surface imperfections in the substrate, and act as a barrier to prevent popping of topcoats during subsequent bakes. It must also provide ultraviolet (UV) protection to any underlying coatings and the substrate.

Material Description.

This primer is part of the total painted product system and must provide a smooth, adhesion-promoting coating direct to substrate or in-mold coating and to subsequent coatings.

Qualified to this Material Specification.

This primer is part of a total painted product system and must meet requirements set forth in the specifications for other materials with which it is used. This specification shall be used in conjunction with the Approved Paint on Plastics System (APOPS), a section of the GM Materials Approved Source List, which lists approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797.

Symbols. Not applicable.

Applicability.

Primers covered under this specification are typically applied to SMC and rigid plastic substrates with a paint bake latitude of approximately 115 °C to 135 °C (240 °F to 275 °F). They are used under an approved topcoat system.

Remarks.

Not applicable.