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5th Edition, October 2016

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Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics

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Active, Most Current

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Product Details:

  • Revision: 5th Edition, October 2016
  • Published Date: October 2016
  • Status: Active, Most Current
  • Document Language: English
  • Published By: General Motors Company (GMNA)
  • Page Count: 3
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This specification covers the requirements for a solventborne, non-conductive, low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and an adhesion promoting surface. The surfacer must be sandable, and have the ability to fill minor surface imperfections in the substrate. It must also provide Ultraviolet (UV) light protection to any underlying coatings and substrates.

Material Description. This primer is part of the total painted product system and must provide a smooth, adhesion promoting coating direct to substrate or in-mold coating and to subsequent coatings. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of the GM Materials Approved Source List, which lists the approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797. Primers approved to this specification must cure and meet all performance requirements at a target bake temperature of 82 °C (180 °F).

Symbols. Not applicable.

Applicability. Primers covered under this specification are typically baked and applied to rigid plastic substrates that could lose functional or dimensional integrity at higher bake temperatures. They are used under an approved topcoat system.

Remarks. Not applicable.