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5th Edition, October 1, 2016

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High Bake, Solventborne Non-Conductive Rigid Primer for Plastics

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Product Details:

  • Revision: 5th Edition, October 1, 2016
  • Published Date: October 2016
  • Status: Active, Most Current
  • Document Language: English
  • Published By: General Motors Company (GMNA)
  • Page Count: 3
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings. The primer must be sandable and have the ability to fill minor surface imperfections in the substrate.

Material Description. This nonconductive primer is part of a total painted product system and must meet requirements set forth in the specifications for other materials with which it is used. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of the GM Materials Approved Source List, which lists the approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797. This primer is part of a total painted product system and must provide a smooth, adhesion promoting coating direct to substrate or in-mold coating and to subsequent coatings.

Symbols. Not applicable.

Applicability. Primers covered under this specification are typically applied to rigid plastic substrates and baked. They are used under an approved topcoat system.

Remarks. Not applicable.