This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold.
This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results, or both. Several are described in the literature.2 This is a "go-no-go" test and does not grade solderability as excellent, good, fair, and so forth.
This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2 Long, J. B., "A Critical Review of Solderability Testing," in Properties of Electrodeposits, Their Measurement and Significance, edited by Richard Sard, Henry Leidheiser, Jr., and Fielding Ogburn, The Electrochemical Society, 1975.
Harding, W. B., "Solderability Testing," Plating, Vol 52, No. 10, October 1965, pp. 971–981.