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1996 Edition, June 10, 1996

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Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]

Includes all amendments and changes through Reapproval Notice , 2003

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Product Details:

  • Revision: 1996 Edition, June 10, 1996
  • Published Date: January 2003
  • Status: Not Active, See comments below
  • Document Language: English
  • Published By: ASTM International (ASTM)
  • Page Count: 2
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This guide covers recommended design features for test structures used in accelerated stress tests, as described in Test Method F 1260M, to characterize the failure distribution of interconnect metallizations that fail due to electromigration.

This guide is restricted to structures with a straight test line on a flat surface that are used to detect failures due to an open-circuit or a percent-increase in resistance of the test line.

This guide is not intended for testing metal lines whose widths are approximately equal to or less than the estimated mean size of the metal grains in the metallization line.

This guide is not intended for test structures used to detect random defects in a metallization line.

Metallizations tested and characterized are those that are used in microelectronic circuits and devices.