These test methods cover tests to determine the pull strength of
a series of wire bonds. Instructions are provided to modify the
methods for use as a referee method. The methods can be used for
wire bonds made with wire having a diameter of from 0.0007 to 0.003
in. (18 to 76 μm).
NOTE 1-Common usage at the present time considers the term "wire
bond" to include the entire interconnection: both welds and the
intervening wire span.
These test methods can be used only when the loop height of the
wire bond is large enough to allow a suitable hook for pulling to
be placed under the wire.
The precision of these methods has been evaluated for aluminum
ultra-sonic wedge bonds; however, these methods can be used for
gold and copper wedge or ball bonds.2
These methods are destructive. They are appropriate for use in
process development or, with a proper sampling plan, for process
control or quality assurance.
A nondestructive procedure is described in Practice F458.
The values in SI units are to be regarded as standard.
This standard does not purport to address all of the safety
concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and
health practices and determine the applicability of regulatory
limitations prior to use.
2 Harman, G. G., "Microelectronic Ultrasonic
Bonding," NBS Special Publication 400-2, pp. 94-95 and
"Wire Bonding in Microelectronics," Third Edition, McGraw Hill,
2010. Also Microelectronics Reliability 51 (2011), Special Issue on
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