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ASTM F459 2013 Edition, January 1, 2013
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
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These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).

NOTE 1-Common usage at the present time considers the term "wire bond" to include the entire interconnection: both welds and the intervening wire span.

These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.

The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2

These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.

A nondestructive procedure is described in Practice F458.

The values in SI units are to be regarded as standard.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2 Harman, G. G., "Microelectronic Ultrasonic Bonding," NBS Special Publication 400-2, pp. 94-95 and "Wire Bonding in Microelectronics," Third Edition, McGraw Hill, 2010. Also Microelectronics Reliability 51 (2011), Special Issue on Copper bonding.