Revision 02A, December 10, 2002
Standard Test Method for Bow of Silicon Wafers
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TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTACT SCANNING
Description / Abstract:
This test method covers determination of the average amount of bow of
nominally circular silicon
wafers, polished or unpolished, in the free (non-clamped) condition.