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2007 Edition, May 1, 2007

Complete Document

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

Includes all amendments and changes through Change/Amendment , May 1, 2007

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Product Details:

  • Revision: 2007 Edition, May 1, 2007
  • Published Date: May 1, 2007
  • Status: Not Active, See comments below
  • Document Language: English
  • Published By: ASTM International (ASTM)
  • Page Count: 3
  • ANSI Approved: Yes
  • DoD Adopted: No

Description / Abstract:

This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.

NOTE 1—There is no equivalent IEC standard.

*A Summary of Changes section appears at the end of this standard.