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ASTM F638

1988 Edition, May 27, 1988

Complete Document

Standard Specification for Fine Aluminum - 1% Magnesium Wire for Semiconductor Lead-Bonding

Includes all amendments and changes through Reapproval Notice , 2001


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EN
Additional Comments:
W/D NO S/S
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Product Details:

  • Revision: 1988 Edition, May 27, 1988
  • Published Date: January 2001
  • Status: Not Active, See comments below
  • Document Language: English
  • Published By: ASTM International (ASTM)
  • Page Count: 3
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

1. Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.