1990 Edition, August 31, 1990
Basic Environmental Testing Procedures Part 2.1Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
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Description / Abstract:
Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1