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BS 4584-103.1

1990 Edition, February 28, 1990

Complete Document

Metal-Clad Base Materials for Printed Circuits Part 103: Special Materials Used in Connection with Printed Circuits Section 103.1: Specification for Prepreg for Use as a Bonding Sheet Material in the Fabrication of Multilayer Printed Boards



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W/D NO S/S
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Product Details:

  • Revision: 1990 Edition, February 28, 1990
  • Published Date: February 28, 1990
  • Status: Not Active, See comments below
  • Document Language: English
  • Published By: British Standards Institution (BSI)
  • Page Count: 12
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.