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BS 4584-103.2

1990 Edition, February 28, 1990

Complete Document

Metal-Clad Base Materials for Printed Circuits Part 103: Materials Used in Connection with Printed Circuits Section 103.2: Copper Foil for Use in the Manufacture of Copper-Clad Base Materials



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Active, Most Current

EN
Additional Comments:
SAME AS IEC 249-3A
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Product Details:

  • Revision: 1990 Edition, February 28, 1990
  • Published Date: January 1990
  • Status: Active, Most Current
  • Document Language: English
  • Published By: British Standards Institution (BSI)
  • Page Count: 14
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

For use in the manufacture of copper clad laminated sheets and of copper clad flexible materials used for printed wiring.