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BS EN 62435-5

2017 Edition, April 30, 2017

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Electronic components — Long-term storage of electronic semiconductor devices Part 5: Die and wafer devices

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Product Details:

  • Revision: 2017 Edition, April 30, 2017
  • Published Date: April 30, 2017
  • Status: Active, Most Current
  • Document Language: English
  • Published By: British Standards Institution (BSI)
  • Page Count: 26
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This part of IEC 62435, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.