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DIN EN 60191-6-18

2010 Edition, August 1, 2010

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Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010



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GERMAN * SAME AS IEC 60191-6-18
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Product Details:

  • Revision: 2010 Edition, August 1, 2010
  • Published Date: August 2010
  • Status: Active, Most Current
  • Document Language: German
  • Published By: Deutsches Institut fur Normung E.V. (DIN)
  • Page Count: 22
  • ANSI Approved: No
  • DoD Adopted: No

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