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DIN EN 61190-1-1

2003 Edition, January 1, 2003

Complete Document

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002



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Product Details:

  • Revision: 2003 Edition, January 1, 2003
  • Published Date: January 2003
  • Status: Active, Most Current
  • Document Language: German
  • Published By: Deutsches Institut fur Normung E.V. (DIN)
  • Page Count: 22
  • ANSI Approved: No
  • DoD Adopted: No

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