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DS/EN 61188-5-1

2003 Edition, January 29, 2003

Complete Document

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

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Active, Most Current

Additional Comments:
SAME AS IEC 61188-5-1
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Product Details:

  • Revision: 2003 Edition, January 29, 2003
  • Published Date: January 29, 2003
  • Status: Active, Most Current
  • Document Language: English
  • Published By: Dansk Standardiseringsrad (DS)
  • Page Count: 78
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.