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DS/EN 62435-5

2017 Edition, April 3, 2017

Complete Document

Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices

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Active, Most Current

Additional Comments:
SAME AS IEC 62435-5
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Product Details:

  • Revision: 2017 Edition, April 3, 2017
  • Published Date: April 3, 2017
  • Status: Active, Most Current
  • Document Language: English
  • Published By: Dansk Standardiseringsrad (DS)
  • Page Count: 26
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

<p class="PARAGRAPH"> IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes.  Typically, this part is used in conjunction with <a href="https://webstore.iec.ch/publication/31455">IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage. <o:p></o:p>