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DSF/FPREN 60749-3

2016 Edition, 2016

Complete Document

Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination

Includes all amendments and changes through Draft , 2016

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Product Details:

  • Revision: 2016 Edition, 2016
  • Published Date: January 2016
  • Status: Active, Most Current
  • Document Language: English
  • Published By: Dansk Standardiseringsrad (DS)
  • Page Count: 13
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.