EIA-186-9 Revision E, January 1, 1978
Passive Electronic Component Parts, Test Methods for; Method 9: Solderability
Additional Comments: SAME AS ANSI C83.93 - SEE ALSO EIA-186 SERIES
Published By:Electronic Components Industry Association (ECIA)
This standard defines a test for solderability of solid lead wires, terminals, and conductive accessories of component parts which are to be joined by a soldering operation involving the use of rosin type flux and solder of the types of covered by QQ-S-571. The specific times and temperatures are for lead wires not greater than 0.045 inch (1.14 mm) in diameter. For larger diameter wires, stranded leads or other parts, the test procedure may be modified as outlined in Paragraph 10. This standard includes test conditions which may be selected and referenced as condition 1, or 2 as per Paragraph 7.
The purpose of this test standard is to determine the solderability of solid lead wires, terminals, and other terminations which are normally joined by means of soft solder.
This Standard shall not be construed as a production procedure for soldering operations.
The solderability determination is made on the bask of the ability of the terminal of the part to be wetted by a coat of new solder, to verify that the treatment used in the manufacturing process to facilitate soldering is satisfactory, and that this treatment has been applied to the required portion of the part designed to accommodate a soldered connection.
The applicability of this test standard as to the size of the terminals tested should he considered before use in the referencing specification. The solder temperatures and the dwell times given in this standard are normally limited to component parts with terminals up to 17AWG wire size or 0.045 inch (1.14mm) in diameter. Variation in pot temperature, Paragraph 7, and the immersion procedure, Paragraph 8.2, of the standard will provide for specifications that include larger type terminals.