EIA-251 Revision A, January 1, 1970
Test to Determine the Temperature Rise as a Function of Current in Printed Conductors
Includes all amendments and changes through Reaffirmation Notice , August 1983
Published By:Electronic Components Industry Association (ECIA)
This test method covers a procedure for comparatively determining the effects of printed conductor materials, conductor cross sections, substrate materials, and processes on the temperature -D.C. current characteristics of printed wiring boards. A standard test sample is recommended and defined.