EIA-540B0AA Revision A, October 1, 2001
Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment
Additional Comments: STABILIZED: MARCH 2014
Published By:Electronic Components Industry Association (ECIA)
This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1089 and greater.
The purpose of this detail specification is to provide all information required for the identification and assessment of the BGA socket described herein. The information, contained herein or by reference, is complete and sufficient for inspection purposes.