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EIA-216

59th Edition, 1959

Complete Document

Adhesion of Printed Wiring, Method of Test for

Includes all amendments and changes through Reaffirmation Notice , August 1983


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SAME AS ANSI C83.78
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Description / Abstract:

This Standard is intended for determining the following characteristics of printed wiring boards: (a) resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of conductors at standard room temperature before and after solder dipping, and at elevated temperatures, and (c) resistance of large conductor areas to blistering as a result of solder dipping.