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EIA-251

Revision A, January 1, 1970

Complete Document

Test to Determine the Temperature Rise as a Function of Current in Printed Conductors

Includes all amendments and changes through Reaffirmation Notice , August 1983


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Description / Abstract:

This test method covers a procedure for comparatively determining the effects of printed conductor materials, conductor cross sections, substrate materials, and processes on the temperature -D.C. current characteristics of printed wiring boards. A standard test sample is recommended and defined.