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EIA-540ABAA

91st Edition, March 1, 1991

Complete Document

Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , January 2015


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Description / Abstract:

The Chip Carrier Sockets of assessed quality covered by this detail specification shall have:

a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1.

b) A working voltage not exceeding 125 volts (rms)

c) Current not exceeding 1 ampere per pin.

OBJECT

The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes.