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EIA-540FA00

92nd Edition, April 1992

Complete Document

Blank Detail Specification for Multi-Package Module Sockets for Use in Electronic Equipment

Includes all amendments and changes through Reaffirmation Notice , November 1997


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Description / Abstract:

The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed ____ volts (mis).

c) Current not to exceed ____ amperes per pin.

OBJECT

The object of this Detail Specification is to provide all information required for, using Sectional Specification Eh-540F000 as a base, for the identification and quality assessment of Multi- Package Module sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.