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EIA-540FAAA

92nd Edition, June 10, 1992

Complete Document

Detail Specification for Multi- Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , April 2013


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Description / Abstract:

The Muiti-Package Moduie Sockets of assessed & quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working vottage not to exceed 250 votts (mis).

c) Current not to exceed 1.0 ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required usìng Sectionai Specification EIA-54ûFûûû as a base, for the identification and quality assessment of Muiti- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.