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EIA-540FAAB

92nd Edition, June 10, 1992

Complete Document

Detail Specification for Multi- Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , April 2013


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Description / Abstract:

The Multi-Package Module Sockets of aswssed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed 250 volts (mis).

c) Current not to exceed 1.0 ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required using Sectional Specification EA-54ûFûûû as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quaMy system. The information contained herein or by reference is complete and sufficient for inspection purposes.