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1993 Edition, October 1993

Complete Document

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , May 2013

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Description / Abstract:

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.

b) A working voltage not exceeding 125 volts (rms)

c) Current not exceeding 1 ampere per pin


The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EIA/JEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspect ion purposes.