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2012 Edition, October 2012

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Active, Most Current

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ISBN: 9780470979716
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Product Details:

  • Revision: 2012 Edition, October 2012
  • Published Date: October 2012
  • Status: Active, Most Current
  • Document Language:
  • Published By: John Wiley and Sons (WILEY)
  • Page Count: 226
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:


This text, ESD Basics: From Semiconductor Manufacturing to Product Use was initiated on the need to produce a text that addresses fundamentals of electrostatic discharge from the manufacturing environment to today's products. As the manufacturing world evolves, semiconductor networks scale, and systems are changing, the needs and requirements for reliability and ESD protection are changing. A text is required that connects basic ESD phenomena to today's real world environment.

Whereas significant texts are available today to teach experts on ESD on-chip design, there is a need for non-experts, non-technical and layman to understand the problems facing the world today. Today, real world ESD and EMI issues surround us; from exploding gas tanks, electrostatic discharge problems in automobiles, cable-induced latchup of computer servers, to automotive noise related issues. Hence, there is a need for non-experts to understand the issues that revolve around us, and what do we do to avoid them.

This text has multiple goals.

The first goal of the text is to teach the basics of electrostatics, and tribo-electric charging and relate them to the electrostatic discharge processes in semiconductor manufacturing, handling and assembly. While teaching some fundamentals, I added some history as well.

The second goal of the text is to teach the electrostatic discharge (ESD), tribo-charging, electrical overstress (EOS), and latchup subject matter. The text opens the door on the issues of electromagnetic interference (EMI) and electromagnetic compatibility (EMC).

The third goal is to relate these processes to modern day chips, and systems in today's world. Hopefully, the examples of problems today will make it more relevant, entertaining and a little fun as well.

The fourth goal is to demonstrate how to protect semiconductor chips with on-chip protection networks.

The fifth goal is to expose the reader to ESD testing of both semiconductor chips and systems.

The sixth goal is to discuss where the future lies with ESD phenomena, standards, testing and future products.

The seventh goal is to provide a glimpse into the future with new nano-structures and nano-systems, and the anticipated electrostatic and electromagnetic issues ahead!

This text, ESD: From SemiconductorManufacturing to Product Use will contain the following:

• Chapter 1 introduces the reader to an overview of the language and fundamentals associated with electrostatics. In Chapter 1, a brief discussion of electrostatics, and tribo-electrical phenomena is weaved into the individuals, dates, and history: Thales of Miletus, Gray, Dufay, Franklin, Toepler, Faraday, Cavendish, Coulomb, to Maxwell – just to mention a few. The chapter then quickly fast-forwards to today's issues of electrostatic discharge (ESD), electrical overstress (EOS), latchup, electromagnetic interference (EMI), and electromagnetic compatibility (EMC) in components and systems.

• Chapter 2 discusses electrostatic discharge control in manufacturing environments. In this chapter, the objective is to provide the reader with a taste of the issues, test methods, standards, and control programs in manufacturing to provide an ESD protected area.

• In Chapter 3, the subject switches to focus on a deeper look at electrostatic discharge (ESD), electrical overstress (EOS), electromagnetic interference (EMI) and electromagnetic compatibility (EMC). Each of these fields has a vast number of publications, literature, and books. In the introduction, I have provided some of the language, terms, and testing standards.

• In Chapter 4, system level concerns associated with ESD, EOS, latchup, EMI, and EMC have been discussed relevant to today's application and the future. A brief discussion of electrostatic issues in servers, laptops, hand-held devices, cell phones, disk drives, digital cameras, autos, and space applications was reviewed to educate the reader in the vast number of issues in today's electronic environment. System level ESD tests, such as IEC 61000-4-2, HMM, CDE, and CBM are discussed.

• Chapter 5 focuses on semiconductor component solutions. The focus of the chapter is on "on-chip" ESD protection networks. ESD protection in digital, analog, and RF applications are discussed. In this chapter, ESD circuits schematics, layout, and semiconductor chip floor planning are also discussed.

• Chapter 6 focuses on system level solutions. System level solutions being practiced today are shown for ESD, EMI, and EMC. New concepts such as system level EMC scanning techniques are discussed.

• Chapter 7 discusses ESD protection for today's and tomorrow's nanostructure technology. As the dimensional scaling of devices approaches the nano-meter dimensions, all devices will have to address the implications of static charge, electrostatic discharge (ESD), electromagnetic interference (EMI), and electrical overstress (EOS). This will be true in photo-masks, magnetic recording devices, semiconductor devices, nano-wires to nanotubes. This concluding chapter takes a look at micro-motors, micro-mirrors, RF MEM switches, and many novel devices.

This introductory text will hopefully pique your interest in the field of electrostatic discharge (ESD), electrical overstress (EOS), electromagnetic interference (EMI), and electromagnetic compatibility (EMC) - and teach how it relates to today's world. To establish a stronger knowledge of ESD protection, it is advisable to read the other texts ESD: Physics and Devices, ESD: Circuits and Technology, ESD: RF Circuits and Technology, ESD: Failure Mechanisms and Models, ESD: Design and Synthesis, and Latchup.

Enjoy the text, and enjoy the subject of ESD, EOS, latchup, EMI, and EMC phenomena.