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GM2204M Revision C, July 1989
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DIELECTRIC EMBOSSING SUBFOUNDATION BOARD
Includes all amendments and changes through Inactive Notice , June 2003
Additional Comments: ENGLISH * INAC NO S/S
Page Count:3
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This specification covers the requirements of a waterproofed, homogeneous solid fiber sheet having a dielectrially active plastic film or coating on one facing. The sheet may be used as a trim subfoundation in conjunction with embossing processes using resin treated paddings.