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IEC 60068-2-54 2nd Edition, April 1, 2006
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Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method
Additional Comments: **SEE ALSO IEC 60068 SET** BILINGUAL
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This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.

This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.