Hello. Sign In
Standards Store

IEC 60068-2-54

2nd Edition, April 1, 2006

Complete Document

Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method



Detail Summary

Active, Most Current

EN
FR
Additional Comments:
**SEE ALSO IEC 60068 SET** BILINGUAL
Format
Details
Price (USD)
PDF
Single User
$121.00
Print
In Stock
$121.00
Add to Cart

People Also Bought These:

49 CFR 400-571
ASME Y14.43
ASTM B117
ASTM B545

Product Details:

  • Revision: 2nd Edition, April 1, 2006
  • Published Date: April 2006
  • Status: Active, Most Current
  • Document Language: English, French
  • Published By: International Electrotechnical Commission (IEC)
  • Page Count: 24
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.

This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.