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IEC 60068-2-54

2nd Edition, April 1, 2006

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Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method

Includes all amendments and changes through Change/Amendment , April 2006


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Superseded By: IEC 60068-2-69

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W/D S/S BY IEC 60068-2-69
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Description / Abstract:

This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.

This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.