 Preview

IEC 61191-3 Ed. 2.0 b:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

standard by International Electrotechnical Commission , 05/30/2017

View all product details

Most Recent

Track It

- Available Formats
  ℹ
- Options
- Availability
- Priced From ( in USD )
- PDF
- 👥
- Immediate download
- $145.00
- Add to Cart
- Printed Edition
- Ships in 1-2 business days
- $145.00
- Add to Cart

Customers Who Bought This Also Bought

IEC 60286-4 Ed. 3.0 b:2013
Priced From $95.00
IEC 62194 Ed. 1.0 b:2005
Priced From $278.00
IEC/TS 62454 Ed. 1.0 b:2007
Priced From $190.00
IEC 60917-2-5 Ed. 1.0 b:2012
Priced From $145.00

Full Description

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Product Details

Edition:: 2.0
Published:: 05/30/2017
Number of Pages:: 40
File Size:: 1 file , 1.3 MB
Note:: This product is unavailable in Ukraine, Russia, Belarus, Canada