2221117 Preview

IEC 61189-5-301 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

standard by International Electrotechnical Commission , 03/17/2021

View all product details

Most Recent

Track It

Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $278.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).

This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.

This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 ?m or less).
 

Product Details

Edition:
1.0
Published:
03/17/2021
Number of Pages:
64
File Size:
1 file , 4.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada