IEC/PAS 62137-3

1st Edition, November 1, 2008

Complete Document

Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints

Product Details:

• Revision: 1st Edition, November 1, 2008
• Published Date: November 2008
• Status: Superseded By:
• Superseded By: IEC 62137-3
• Document Language: English
• Published By: International Electrotechnical Commission (IEC)
• Page Count: 46
• ANSI Approved: No
• DoD Adopted: No

Description / Abstract: